The unleaded solder paste is used to link lead on the surface increased integrated circuit chips to the attachment points on printed circuits boards. Lead is commonly applied as a paste through a stencil, or dispensing tubes, on the leads on printed circuit boards, shadowed by the heating the paste for it to melt and vehemence the connection. Requirement for the smart electronics products, such as smartphones and tablets, computer motherboards, customer electronic products, and network servers, has been increasing, which in turn is projected to drive the worldwide unleaded solder paste market.
According to the report analysis, ‘Global Unleaded Solder Paste Market Status (2015-2019) and Forecast (2020-2024) by Region, Product Type & End-Use’ states that Senju Metal Industry, Tamura, Weiteou, Alpha, KOKI, Kester, Tongfang Tech, Yashida, Henkel AG & Co., Huaqing Solder, Chengxing Group, AMTECH, Union Soltek Group, Indium Corporation, Nihon Superior, Shenzhen Bright, Qualitek, Nihon GenmaMfg, AIM Solder, Nordson, Interflux Electronics, Balver Zinn Josef Jost, MG Chemicals, UchihashiEstec, Guangchen Metal Products, DongGuanLegret Metal, Nihon Almit, Zhongya Electronic Solder, Yanktai Microelectronic Material, and Tianjin Songben are the key companies which recently operating more significantly for leading the highest market growth and dominating the great value of market share around the globe during the short span of time while spreading the awareness connected to such, delivering the better consumer satisfaction, decreasing the connected price, employing the young work force, implementing the policies and strategies of profit making, establishing the several research and development programs and analyzing and studying the strategies and policies of the government as well as competitors.
In addition, the numerous governments around the globe are emphasizing on the substitution of lead solders owing to their toxic nature. This is predicted to propel the unleaded solder paste market. Unleaded solder paste is an interruption of solder particles in a solder flux, which is broadly used in electronic assembly materials. Printed circuit boards are also optimized in electronic components that are assimilated in automotive, marine vehicles, and the aerospace industry. Furthermore, the unleaded solder paste market around North America is primarily propelled by the enlargement of the electronics refurbishing industry. Although, key players are aimed on the development of new approaches to produce advanced solder materials, such as Sn-Bi-Ag alloy, which decreases the foremost thermal excursion throughout electronic assembly.
Not only has this, in terms of geography, the worldwide unleaded solder paste market can be split around five regions: North America, Europe, Asia Pacific, Latin America, and Middle East & Africa. The Asia Pacific predicted to account for a foremost share of the worldwide unleaded solder paste market during the recent past years. The unleaded solder paste market around Asia Pacific is enlarging significantly, primarily owing to enlargement of electronics and automotive industries in the region, majorly around China and India. Growth in FDIs in automotive and electronics industries in developing regions of Asia Pacific is a foremost factor that is likely to propel the market in the region during the forecast duration. The market around Europe and Middle East & Africa is predicted to expand at a significant pace throughout the forecast period, due to enlargement of automotive and electronics industries in such regions.
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Ankur Gupta, Head Marketing & Communications