Solder Paste Market Research: Global Status & Forecast by Geography, Type & Application (2015-2025)
Region:Global
Product Code:99SGL228Che20190500003710
May 2019
66
About the Report
According to 99Strategy, the Global Solder Paste Market is estimated to reach xxx million USD in 2019 and projected to grow at the CAGR of xx% during the 2020-2025. The report analyses the global Solder Paste market, the market size and growth, as well as the major market participants.
The analysis includes market size, upstream situation, market segmentation, market segmentation, price & cost and industry environment. In addition, the report outlines the factors driving industry growth and the description of market channels.The report begins from overview of industrial chain structure, and describes the upstream. Besides, the report analyses market size and forecast in different geographies, type and end-use segment, in addition, the report introduces market competition overview among the major companies and companies profiles, besides, market price and channel features are covered in the report.
Key Regions
Asia Pacific
North America
Europe
South America
Middle East & Africa
Key Companies
Senju
Alpha
Shengmao
Tamura
Henkel
Kester
Indium
INVENTEC(AVANTEC)
KOKI
AIM
Nihon Superior
KAWADA
Yashida
Tongfang Tech
Shenzhen Bright
Yonganflux
Key Product Type
Rosin Based Pastes
Water Soluble Fluxes
No-clean Flux
Market by Application
SMT Assembly
Semiconductor Packaging
Others
Main Aspects covered in the Report
Overview of the Solder Paste market including production, consumption, status & forecast and market growth
2015-2018 historical data and 2019-2025 market forecast
Geographical analysis including major countries
Overview the product type market including development
Overview the end-user market including development
Scope of the Report
Products
Table of Contents
Table of Content
1 Industrial Chain Overview
1.1 Solder Paste Industry
1.1.1 Overview
1.1.2 Characteristics of Solder Paste
1.2 Upstream
1.2.1 Major Materials
1.2.2 Manufacturing Overview
1.3 Product List By Type
1.3.1 Rosin Based Pastes
1.3.2 Water Soluble Fluxes
1.3.3 No-clean Flux
1.4 End-Use List
1.4.1 Demand in SMT Assembly
1.4.2 Demand in Semiconductor Packaging
1.4.3 Demand in Others
1.5 Global Market Overview
1.5.1 Global Market Size and Forecast, 2015-2025
1.5.2 Global Market Size and Forecast by Geography with CAGR, 2015-2025
1.5.3 Global Market Size and Forecast by Product Type with CAGR, 2015-2025
1.5.4 Global Market Size and Forecast by End-Use with CAGR, 2015-2025
2 Global Production & Consumption by Geography
2.1 Global Production & Consumption
2.1.1 Global Production
2.1.2 Global Consumption
2.2 Geographic Production & Consumption
2.2.1 Production
2.2.1.1 Asia-Pacific
2.2.1.2 North America
2.2.1.3 South America
2.2.1.4 Europe
2.2.1.5 Middle East & Africa
2.2.2 Consumption
2.2.2.1 Asia-Pacific
2.2.2.2 North America
2.2.2.3 South America
2.2.2.4 Europe
2.2.2.5 Middle East & Africa
3 Major Manufacturers Introduction
3.1 Manufacturers Overview
3.2 Manufacturers List
3.2.1 Senju Overview
3.2.1.1 Product Specifications
3.2.1.2 Business Data (Production Volume (Volume), Production Amount (Million USD), Price, Cost, Margin)
3.2.1.3 Recent Developments
3.2.1.4 Future Strategic Planning
3.2.2 Alpha Overview
3.2.2.1 Product Specifications
3.2.2.2 Business Data (Production Volume (Volume), Production Amount (Million USD), Price, Cost, Margin)
3.2.2.3 Recent Developments
3.2.2.4 Future Strategic Planning
3.2.3 Shengmao Overview
3.2.3.1 Product Specifications
3.2.3.2 Business Data (Production Volume (Volume), Production Amount (Million USD), Price, Cost, Margin)
3.2.3.3 Recent Developments
3.2.3.4 Future Strategic Planning
3.2.4 Tamura Overview
3.2.4.1 Product Specifications
3.2.4.2 Business Data (Production Volume (Volume), Production Amount (Million USD), Price, Cost, Margin)
3.2.4.3 Recent Developments
3.2.4.4 Future Strategic Planning
3.2.5 Henkel Overview
3.2.5.1 Product Specifications
3.2.5.2 Business Data (Production Volume (Volume), Production Amount (Million USD), Price, Cost, Margin)
3.2.5.3 Recent Developments
3.2.5.4 Future Strategic Planning
3.2.6 Kester Overview
3.2.6.1 Product Specifications
3.2.6.2 Business Data (Production Volume (Volume), Production Amount (Million USD), Price, Cost, Margin)
3.2.6.3 Recent Developments
3.2.6.4 Future Strategic Planning
3.2.7 Indium Overview
3.2.7.1 Product Specifications
3.2.7.2 Business Data (Production Volume (Volume), Production Amount (Million USD), Price, Cost, Margin)
3.2.7.3 Recent Developments
3.2.7.4 Future Strategic Planning
3.2.8 INVENTEC(AVANTEC) Overview
3.2.8.1 Product Specifications
3.2.8.2 Business Data (Production Volume (Volume), Production Amount (Million USD), Price, Cost, Margin)
3.2.8.3 Recent Developments
3.2.8.4 Future Strategic Planning
3.2.9 KOKI Overview
3.2.9.1 Product Specifications
3.2.9.2 Business Data (Production Volume (Volume), Production Amount (Million USD), Price, Cost, Margin)
3.2.9.3 Recent Developments
3.2.9.4 Future Strategic Planning
3.2.10 AIM Overview
3.2.10.1 Product Specifications
3.2.10.2 Business Data (Production Volume (Volume), Production Amount (Million USD), Price, Cost, Margin)
3.2.10.3 Recent Developments
3.2.10.4 Future Strategic Planning
3.2.11 Nihon Superior Overview
3.2.11.1 Product Specifications
3.2.11.2 Business Data (Production Volume (Volume), Production Amount (Million USD), Price, Cost, Margin)
3.2.11.3 Recent Developments
3.2.11.4 Future Strategic Planning
3.2.12 KAWADA Overview
3.2.12.1 Product Specifications
3.2.12.2 Business Data (Production Volume (Volume), Production Amount (Million USD), Price, Cost, Margin)
3.2.12.3 Recent Developments
3.2.12.4 Future Strategic Planning
3.2.13 Yashida Overview
3.2.13.1 Product Specifications
3.2.13.2 Business Data (Production Volume (Volume), Production Amount (Million USD), Price, Cost, Margin)
3.2.13.3 Recent Developments
3.2.13.4 Future Strategic Planning
3.2.14 Tongfang Tech Overview
3.2.14.1 Product Specifications
3.2.14.2 Business Data (Production Volume (Volume), Production Amount (Million USD), Price, Cost, Margin)
3.2.14.3 Recent Developments
3.2.14.4 Future Strategic Planning
3.2.15 Shenzhen Bright Overview
3.2.15.1 Product Specifications
3.2.15.2 Business Data (Production Volume (Volume), Production Amount (Million USD), Price, Cost, Margin)
3.2.15.3 Recent Developments
3.2.15.4 Future Strategic Planning
3.2.16 Yonganflux Overview
3.2.16.1 Product Specifications
3.2.16.2 Business Data (Production Volume (Volume), Production Amount (Million USD), Price, Cost, Margin)
3.2.16.3 Recent Developments
3.2.16.4 Future Strategic Planning
4 Market Competition Pattern
4.1 Market Size and Sketch
4.2 Company Market Share
4.2.1 Global Production by Major Manufacturers
4.2.2 Market Concentration Analysis
4.3 Market News and Trend
4.3.1 Merger & Acquisition
4.3.2 New Product Launch
5 Product Type Segment
5.1 Global Overview by Product Type Segment
5.2 Segment Subdivision by Product Type
5.2.1 Market in Rosin Based Pastes
5.2.1.1 Market Size
5.2.1.2 Situation & Development
5.2.2 Market in Water Soluble Fluxes
5.2.2.1 Market Size
5.2.2.2 Situation & Development
5.2.3 Market in No-clean Flux
5.2.3.1 Market Size
5.2.3.2 Situation & Development
6 End-Use Segment
6.1 Global Overview by End-Use Segment
6.2 Segment Subdivision
6.2.1 Market in SMT Assembly
6.2.1.1 Market Size
6.2.1.2 Situation & Development
6.2.2 Market in Semiconductor Packaging
6.2.2.1 Market Size
6.2.2.2 Situation & Development
6.2.3 Market in Others
6.2.3.1 Market Size
6.2.3.2 Situation & Development
7 Market Forecast & Trend
7.1 Regional Forecast
7.2 Consumption Forecast
7.2.1 Product Type Forecast
7.2.2 End-Use Forecast
7.3 Investment Trend
7.4 Consumption Trend
8 Price & Channel
8.1 Price and Cost
8.1.1 Price
8.1.2 Cost
8.2 Channel Segment
9 Market Drivers & Investment Environment
9.1 Market Drivers
9.2 Investment Environment
10 Research Conclusion
Research Methodology
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